2015 · 23 citations · 4 references
EngineeringRf Instrumentation ApplicationsRadio FrequencyIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic CompatibilityMicro-electromechanical SystemRf SemiconductorAdvanced Packaging (Semiconductors)Radio Frequency Micro-electromechanical SystemsInstrumentationElectronic PackagingElectronic CircuitElectrical EngineeringMicroelectronicsLong Term ReliabilityMicrofabricationPlastic PackageIntegrated Driver CircuitryMiniature Qfn PackageRf Subsystem
This paper describes the commercialization of a reliable RF single pole four throw (SP4T) micro-electromechanical systems (MEMS) switch with integrated driver circuitry which is targeted at RF instrumentation applications. The integrated switch solution is mass produced in a high volume sub-micron semiconductor Class1 clean room manufacturing facility, fabricated on a low loss substrate and utilizes a wafer level silicon capping technology. This device achieves a low insertion loss of 0.52dB typical at 6GHz, a wide -3dB RF bandwidth of 11GHz to 14GHz and a minimum actuation lifetime of 1 billion cycles; and is presented in a small 5mm × 4mm × 0.95mm 24-pin quad flat no leads (QFN) plastic package. Topics discussed in the paper include the motivation for the development, fabrication, long term reliability and switch characteristics.
4
Low-loss RF MEMS metal-to-metal contact switch with CSP structure
T. Seki, S. Sato, Takahiro Masuda et al. · 2004 · 19 citations
Engineering, Csp Structure, Micro-electromechanical System +16