A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme

Abstract

An inductively coupled wireless interface achieves aggregated data rate of 195Gbit/s among 4 stacked chips in a package by arranging 195 transceivers in 50/spl mu/m pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the crosstalk of the system.