Ultra-compact G-band 16way power splitter/combiner module fabricated through a new method of 3D-copper additive manufacturing

Abstract

A new design and fabrication methodology for mmw and sub-mmw components is defined. The 3D copper additive manufacturing process is described with a full 3D volumetric 16 way splitter-combiner demonstration at G-band frequency range. The WR4 combiner is folded through design compaction and then sliced through its Z-direction and fabricated as slices to form a final 23 slice stack. The stack was then measured at 200-270 GHz using a WR4 test-through waveguide that traverses through the entire stack. The insertion loss measured at only 0.03 dB/mm showcasing its low loss characteristics. The 16 way splitter -combiner back to back was also tested using micro-machined WR4 through lines, fabricated and measured at an overall insertion loss of 4dB. The results highlight the success of the volumetric design in which a 16 way combiner measures <; 2dB insertion loss and occupies no more than 3.6 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> volume.