Concepedia

Microstructural evolution during transient liquid-phase bonding in a Ni-base superalloy/sapphire fiber composite

Ming-Wei Tseng, D. B. Williams, Kamal Soni, R. Levi‐Setti

Journal of Materials Science · 1999 · 13 citations · 10 references

DOI

References

10

Physical and mechanical metallurgy of Ni<sub>3</sub>Al and its alloys

N.S. Stoloff · International Materials Reviews · 1989 · 344 citations

, , +14

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 329 citations

, , +5

Transient Liquid Phase Bonding

W. D. MacDonald, Thomas W. Eagar · Annual Review of Materials Science · 1992 · 304 citations

, , +10

TLP bonding: a new method for joining heat resistant alloys

D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations

, , +9

Diffusion-bonding of TiAl

Pei Yan, E. R. Wallach · Intermetallics · 1993 · 71 citations

, , +3