Optocap (United Kingdom)

Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging Platform

Lars Zimmermann, Giovan Battista Preve, Tolga Tekin et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2010 · 43 citations · Full text

Engineering, Electrical Engineering, Materials Science +16

OFDM/WDM PON With Laserless, Colorless 1  Gb/s ONUs Based on Si-PIC and Slow IC

Amos Agmon, Moshe Nazarathy, Dan M. Marom et al. · Journal of Optical Communications and Networking · 2014 · 21 citations

Engineering, Computer Engineering, Electrical Engineering +17

Design, integration, and testing of a compact FBG interrogator, based on an AWG spectrometer

Andrea Trita, Garrie Vickers, Iker Mayordomo et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2014 · 16 citations

Engineering, Electrical Engineering, Photonics +16

Integrated RGB laser light module for autostereoscopic outdoor displays

Jörg Reitterer, Franz Fidler, Christian Hambeck et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2015 · 11 citations

Engineering, Electrical Engineering, Optics +15

Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration

Thomas Brunschwiler, Gerd Schlottig, Araavind Sridhar et al. · 2017 · 11 citations

Engineering, Computer Engineering, Electrical Engineering +17