Enervana Technologies (United States)

Experimental investigation of Cu-based, double-layered, microchannel heat exchangers

Bin Lü, W. J. Meng, Fanghua Mei · Journal of Micromechanics and Microengineering · 2013 · 47 citations

From micro- to nano-scale molding of metals: Size effect during molding of single crystal Al with rectangular strip punches

Ke Chen, W. J. Meng, Fanghua Mei et al. · Acta Materialia · 2010 · 24 citations

Materials Science, Engineering, Microfabrication +11

Fabrication, assembly and heat transfer testing of low-profile copper-based microchannel heat exchangers

Bin Lü, Ke Chen, W. J. Meng et al. · Journal of Micromechanics and Microengineering · 2010 · 21 citations

Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system

Bin Lü, W. J. Meng, Fanghua Mei · Microsystem Technologies · 2011 · 19 citations

Engineering, Experimental Assessment, Liquid Metal Cooling +15

Low temperature deposited titanium boride thin films and their application to surface engineering of microscale mold inserts

Yang Mu, Ke Chen, W. J. Meng et al. · Microsystem Technologies · 2012 · 19 citations

Materials Science, Engineering, Material Processing +9