Thermal-electromagnetic Co-simulation
Thermal-Electromagnetic Co-Simulation is a computational simulation framework that integrates thermal and electromagnetic domain models to concurrently analyze their mutual interactions and coupled effects in microwave devices.
281
Publications
11.3K
Citations
1.1K
Authors
375
Institutions
Publications per year
2017–2026
112
Parents
281
1–5 of 281
1.1K
13
h-index
7
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7
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1–5 of 1.1K
375

Sichuan University
Chengdu, China
16 h-index
62 publications
2.5K citations
Chengdu University of Information Technology
Chengdu, China
7 h-index
25 publications
815 citations

Centre National de la Recherche Scientifique
Paris, France
6 h-index
20 publications
1.3K citations
Karlsruhe Institute of Technology
Karlsruhe, Germany
6 h-index
15 publications
767 citations
North Carolina State University
Raleigh, United States
6 h-index
15 publications
566 citations

Shanghai Jiao Tong University
Shanghai, China
5 h-index
12 publications
298 citations

Huazhong University of Science and Technology
Wuhan, China
5 h-index
24 publications
505 citations

Cornell University
Ithaca, United States
5 h-index
12 publications
981 citations
1–8 of 375
18 publications · 1.1K citations
15
h-index
17 publications · 585 citations
14
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JMPEE · 13 publications · 338 citations
12
h-index
10 publications · 279 citations
10
h-index
8 publications · 384 citations
8
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1–5