Thermal-electromagnetic Co-simulation

Thermal-Electromagnetic Co-Simulation is a computational simulation framework that integrates thermal and electromagnetic domain models to concurrently analyze their mutual interactions and coupled effects in microwave devices.

281

Publications

11.3K

Citations

1.1K

Authors

375

Institutions

Publications per year

2017–2026

112

Authors

1.1K

  1. HZ
    Huacheng Zhu

    Sichuan University, China

    13 publications · 659 citations

    13

    h-index

  2. JY
    Jinghua Ye

    Sichuan University, China

    7 publications · 294 citations

    7

    h-index

  3. KH
    Kama Huang

    Sichuan University, China

    7 publications · 379 citations

    7

    h-index

  4. YY
    Yang Yang

    Sichuan University, China

    6 publications · 212 citations

    6

    h-index

  5. KH
    Kama Huang

    Sichuan University, China

    5 publications · 157 citations

    5

    h-index

1–5 of 1.1K

Venues

  1. 15

    h-index

  2. IEEE Transactions on Magnetics

    17 publications · 585 citations

    14

    h-index

  3. Journal of Microwave Power and Electromagnetic Energy

    JMPEE · 13 publications · 338 citations

    12

    h-index

  4. IEEE Transactions on Applied Superconductivity

    10 publications · 279 citations

    10

    h-index

  5. 8

    h-index

1–5