Thermal Strain Analysis

Thermal Strain Analysis is a theoretical and computational framework within thermoelasticity that characterizes the dimensional changes in materials due to temperature variations by quantifying the resulting strain fields under coupled thermal and mechanical loads.

203

Publications

8.4K

Citations

757

Authors

307

Institutions

Publications per year

2017–2026

60

Authors

757

  1. MM
    Masanori Murakami

    Kyoto University, Japan

    6 publications · 273 citations

    6

    h-index

  2. GA
    G. A. Khoury

    Imperial College London, United Kingdom

    4 publications · 544 citations

    4

    h-index

  3. PB
    P. Bruzzone

    École Polytechnique Fédérale de Lausanne, Switzerland

    3 publications · 59 citations

    3

    h-index

  4. JS
    John S. McCartney

    University of California San Diego, United States

    3 publications · 370 citations

    3

    h-index

  5. LM
    L. Muzzi

    National Agency for New Technologies, Energy and Sustainable Economic Development, Italy

    3 publications · 45 citations

    3

    h-index

1–5 of 757

Venues

  1. IEEE Transactions on Applied Superconductivity

    9 publications · 221 citations

    9

    h-index

  2. Experimental Mechanics

    7 publications · 275 citations

    7

    h-index

  3. Thin Solid Films

    7 publications · 306 citations

    7

    h-index

  4. Applied Optics

    5 publications · 88 citations

    5

    h-index

  5. Journal of Electronic Packaging

    4 publications · 66 citations

    4

    h-index

1–5