Thermal Pads
Thermal Pads is a thermally conductive, compliant interfacial material used in electronic thermal management systems that facilitates efficient heat transfer between heat-generating components and heat dissipation devices by conforming to surface irregularities while maintaining electrical isolation.
58
Publications
3.2K
Citations
261
Authors
105
Institutions
Publications per year
2017–2026
35
Variants
Thermal Conductive PadsThermal Interface Pads
Parents
58
1–5 of 58
261
5
h-index
3
h-index
2
h-index
2
h-index
2
h-index
1–5 of 261
105

Sun Yat-sen University
Guangzhou, China
5 h-index
27 publications
1.5K citations

Central South University
Changsha, China
3 h-index
3 publications
192 citations
Korea Institute of Ceramic Engineering and Technology
Cheonan, South Korea
2 h-index
4 publications
62 citations
Shell (Netherlands)
The Hague, The Netherlands
2 h-index
17 publications
312 citations
Korea Research Institute of Chemical Technology
Daejeon, South Korea
2 h-index
6 publications
82 citations
Shell (Canada)
Calgary, Canada
2 h-index
2 publications
37 citations

Shanghai Jiao Tong University
Shanghai, China
2 h-index
12 publications
366 citations

Northwestern Polytechnical University
Xi'an, China
2 h-index
8 publications
2K citations
1–8 of 105
3 publications · 327 citations
3
h-index
4 publications · 114 citations
3
h-index
2 publications · 48 citations
2
h-index
2 publications · 67 citations
2
h-index
2 publications · 55 citations
2
h-index
1–5