Thermal Pads

Thermal Pads is a thermally conductive, compliant interfacial material used in electronic thermal management systems that facilitates efficient heat transfer between heat-generating components and heat dissipation devices by conforming to surface irregularities while maintaining electrical isolation.

58

Publications

3.2K

Citations

261

Authors

105

Institutions

Publications per year

2017–2026

35

Variants

Thermal Conductive PadsThermal Interface Pads

Authors

261

  1. SC
    Sheng Chu

    Sun Yat-sen University, China

    5 publications · 284 citations

    5

    h-index

  2. GC
    Guang Chu

    Central South University, China

    3 publications · 192 citations

    3

    h-index

  3. DR
    D. R. Brouwer

    Shell (Netherlands), Netherlands

    2 publications · 37 citations

    2

    h-index

  4. HZ
    Hongzhen Zhao

    Northwestern Polytechnical University, China

    2 publications · 504 citations

    2

    h-index

  5. QL
    Qiuguo Li

    Huizhou University, China

    2 publications · 141 citations

    2

    h-index

1–5 of 261

Venues

  1. ACS Applied Materials & Interfaces

    3 publications · 327 citations

    3

    h-index

  2. Applied Thermal Engineering

    4 publications · 114 citations

    3

    h-index

  3. 2

    h-index

  4. 2

    h-index

  5. Nanomaterials

    2 publications · 55 citations

    2

    h-index

1–5