Thermal Envelope Modeling

Thermal Envelope Modeling is a computational modeling method that characterizes the heat transfer dynamics of a building’s enclosing surfaces to simulate energy exchange between conditioned spaces and the external environment.

273

Publications

12.4K

Citations

867

Authors

368

Institutions

Publications per year

2017–2026

132

Authors

867

  1. XX
    Xinhua Xu

    Huazhong University of Science and Technology, China

    5 publications · 378 citations

    5

    h-index

  2. NA
    N. Aste

    Politecnico di Milano, Italy

    3 publications · 172 citations

    3

    h-index

  3. GE
    Gianpiero Evola

    University of Catania, Italy

    3 publications · 274 citations

    3

    h-index

  4. TB
    Tanmay Basak

    Indian Institute of Technology Madras, India

    3 publications · 77 citations

    3

    h-index

  5. NT
    Nian-Feng Tzeng

    University of Louisiana at Lafayette, United States

    3 publications · 144 citations

    3

    h-index

1–5 of 867

Venues

  1. Energy and Buildings

    49 publications · 3.7K citations

    33

    h-index

  2. Building and Environment

    24 publications · 1.2K citations

    21

    h-index

  3. Journal of Building Engineering

    15 publications · 425 citations

    14

    h-index

  4. Applied Thermal Engineering

    13 publications · 679 citations

    13

    h-index

  5. Building Simulation

    10 publications · 254 citations

    10

    h-index

1–5