Thermal Envelope Modeling
Thermal Envelope Modeling is a computational modeling method that characterizes the heat transfer dynamics of a building’s enclosing surfaces to simulate energy exchange between conditioned spaces and the external environment.
273
Publications
12.4K
Citations
867
Authors
368
Institutions
Publications per year
2017–2026
132
Parents
273
1–5 of 273
867
5
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3
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368

Centre National de la Recherche Scientifique
Paris, France
12 h-index
27 publications
1.2K citations
Tsinghua University
Beijing, China
7 h-index
22 publications
849 citations

Hong Kong Polytechnic University
Hong Kong, Hong Kong
5 h-index
11 publications
840 citations

Huazhong University of Science and Technology
Wuhan, China
5 h-index
14 publications
827 citations
Université Claude Bernard Lyon 1
Villeurbanne, France
4 h-index
6 publications
203 citations
Politecnico di Milano
Milan, Italy
4 h-index
21 publications
1.1K citations

Southwest Jiaotong University
Chengdu, China
4 h-index
7 publications
133 citations
Centre d'Énergétique et de Thermique de Lyon
Villeurbanne, France
4 h-index
9 publications
425 citations
1–8 of 368
49 publications · 3.7K citations
33
h-index
24 publications · 1.2K citations
21
h-index
15 publications · 425 citations
14
h-index
13 publications · 679 citations
13
h-index
10 publications · 254 citations
10
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1–5