Thermal Chamber Testing

Thermal Chamber Testing is a thermal validation method that involves subjecting materials, devices, or systems to controlled temperature environments within an enclosed chamber to evaluate their performance, stability, or compliance under specified thermal conditions.

54

Publications

2.3K

Citations

193

Authors

78

Institutions

Publications per year

2017–2026

21

Authors

193

  1. YL
    Yong Li

    South China University of Technology, China

    3 publications · 203 citations

    3

    h-index

  2. AR
    A. Rusinek

    Laboratoire d'Étude des Microstructures et de Mécanique des Matériaux, France

    2 publications · 30 citations

    2

    h-index

  3. MK
    Maciej Klósak

    Laboratoire d'Étude des Microstructures et de Mécanique des Matériaux, France

    2 publications · 30 citations

    2

    h-index

  4. HC
    Hanyin Chen

    South China University of Technology, China

    2 publications · 110 citations

    2

    h-index

  5. ZC
    Zhaoshu Chen

    South China University of Technology, China

    2 publications · 118 citations

    2

    h-index

1–5 of 193

Venues

  1. Applied Thermal Engineering

    7 publications · 560 citations

    7

    h-index

  2. Building and Environment

    3 publications · 216 citations

    3

    h-index

  3. Journal of Electronic Packaging

    2 publications · 39 citations

    2

    h-index

  4. IEEE Transactions on Power Electronics

    2 publications · 101 citations

    2

    h-index

  5. Applied Energy

    1 publications · 43 citations

    1

    h-index

1–5