Joining Kinetics
Joining Kinetics is a scientific framework that characterizes the rate and mechanisms of interfacial bond formation in ceramic materials during joining processes, distinguished from other bonding models by its focus on time-dependent diffusion, chemical reaction dynamics, and microstructural evolution at the joint interface.
115
Publications
4.6K
Citations
405
Authors
143
Institutions
Publications per year
2017–2026
50
Parents
115
Theoretical model for diffusion bonding
Brian Derby, E. R. Wallach · Metal Science · 1982 · 230 citations
Room-temperature soldering with nanostructured foils
Jiaping Wang, E. Besnoin, A. Duckham et al. · Applied Physics Letters · 2003 · 222 citations
Natural Sciences, Materials Engineering, Materials Science +16
Investigating the effect of applied pressure on reactive multilayer foil joining
Jiaping Wang, E. Besnoin, Omar Knio et al. · Acta Materialia · 2004 · 110 citations
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143

Harbin Institute of Technology
Harbin, China
13 h-index
56 publications
1.9K citations
The University of Osaka
Osaka, Japan
6 h-index
16 publications
457 citations

University of L'Aquila
L’Aquila, Italy
6 h-index
15 publications
413 citations

University of Cincinnati
Cincinnati, United States
5 h-index
8 publications
197 citations

Northwestern Polytechnical University
Xi'an, China
4 h-index
10 publications
312 citations

Beijing Institute of Technology
Beijing, China
3 h-index
3 publications
136 citations

National University of Defense Technology
Changsha, China
3 h-index
6 publications
117 citations

Lawrence Berkeley National Laboratory
Berkeley, United States
3 h-index
7 publications
493 citations
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14 publications · 482 citations
14
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JMP · 7 publications · 142 citations
8
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6 publications · 368 citations
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6 publications · 225 citations
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4 publications · 538 citations
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