Foil Adhesive Selection is a methodological construct in materials engineering that determines the optimal adhesive for bonding copper foils to substrates by evaluating interfacial compatibility, thermal stability, and electrical insulation properties within printed circuit board manufacturing processes.
4
Publications
64
Citations
11
Authors
6
Institutions
Publications per year
2017–2026
0
Parents
Publications
4
1–4 of 4
Authors
11
- JJ
1
h-index
- JR
1
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- TL
1
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- SE
1
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- TB
1
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1–5 of 11
Institutions
6
Georgia Institute of Technology
Atlanta, United States
1 h-index
2 publications
36 citations
Samsung (South Korea)
Seoul, South Korea
1 h-index
1 publications
18 citations
Langley Research Center
Hampton, United States
1 h-index
2 publications
36 citations
Korea Advanced Institute of Science and Technology
Daejeon, South Korea
1 h-index
2 publications
36 citations
Columbia College Hollywood
Los Angeles, United States
1 h-index
1 publications
10 citations
MPC Corporation
Pittsburgh, United States
1 h-index
1 publications
18 citations
1–6 of 6
Venues
- The Journal of Adhesion
1 publications · 18 citations
1
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- Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
1 publications · 18 citations
1
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- Energy and Buildings
1 publications · 18 citations
1
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- The Journal of the American Dental Association
JADA · 1 publications · 10 citations
1
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