Concepedia

Cooling System Packaging

Cooling System Packaging is an engineering integration methodology that systematically positions and configures heat exchangers, ducting, pumps, and associated coolant loops within the constrained spatial envelope of a powertrain system to ensure optimal thermal performance, serviceability, and compatibility with adjacent subsystems.

34

Publications

1.6K

Citations

138

Authors

44

Institutions

Publications per year

2017–2026

11

Parents

Publications

34

Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid

Dean C. Wadsworth, Issam Mudawar · Journal of Heat Transfer · 1990 · 131 citations

, , +17

Phase change materials for advanced cooling packaging

Suman Singh, Kirtiraj K. Gaikwad, Youn Suk Lee · Environmental Chemistry Letters · 2018 · 118 citations

, , +14

A forced gas cooling circle packaging with liquid cooling plate for the thermal management of Li-ion batteries under space environment

Shengnan Wang, Yunhua Li, Yunze Li et al. · Applied Thermal Engineering · 2017 · 104 citations

, , +17

Computational modeling of airflow and heat transfer in a vented box during cooling: Optimal package design

Jiawei Han, Chunjiang Zhao, Xinting Yang et al. · Applied Thermal Engineering · 2015 · 103 citations

, , +17

The effect of area ratio on the flow distribution in liquid cooling module manifolds for electronic packaging

Steve H. Choi, Sehyun Shin, Young I. Cho · International Communications in Heat and Mass Transfer · 1993 · 81 citations

, , +14

1–5 of 34

Authors

138

  1. PN
    Puqi Ning

    Chinese Academy of Sciences, China

    3 publications · 112 citations

    3

    h-index

  2. ZL
    Zhenxian Liang

    Oak Ridge National Laboratory, United States

    3 publications · 112 citations

    3

    h-index

  3. CZ
    Chunjiang Zhao

    National Engineering Research Center for Information Technology in Agriculture, China

    2 publications · 168 citations

    2

    h-index

  4. XY
    Xinting Yang

    National Engineering Research Center for Information Technology in Agriculture, China

    2 publications · 168 citations

    2

    h-index

  5. RS
    Roger Schmidt

    Poughkeepsie Public Library District, United States

    2 publications · 104 citations

    2

    h-index

1–5 of 138

Institutions

44

  1. Poughkeepsie Public Library District

    Poughkeepsie, United States

    4 h-index

    14 publications

    510 citations

  2. Oak Ridge National Laboratory

    Oak Ridge, United States

    3 h-index

    8 publications

    276 citations

  3. National Transportation Research Center

    Knoxville, United States

    3 h-index

    8 publications

    276 citations

  4. National Engineering Research Center for Information Technology in Agriculture

    Beijing, China

    2 h-index

    10 publications

    840 citations

  5. Beijing University of Technology

    Beijing, China

    2 h-index

    2 publications

    168 citations

  6. University of Tennessee at Knoxville

    Knoxville, United States

    2 h-index

    2 publications

    86 citations

  7. Peking University

    Beijing, China

    2 h-index

    9 publications

    225 citations

  8. KU Leuven

    Leuven, Belgium

    2 h-index

    4 publications

    220 citations

1–8 of 44

Venues

  1. Applied Thermal Engineering

    5 publications · 323 citations

    5

    h-index

  2. IBM Journal of Research and Development

    2 publications · 106 citations

    2

    h-index

  3. Journal of Heat Transfer

    1 publications · 131 citations

    1

    h-index

  4. Postharvest Biology and Technology

    1 publications · 59 citations

    1

    h-index

  5. Heat Transfer Engineering

    1 publications · 78 citations

    1

    h-index

1–5