Conduction Cooling

Conduction Cooling is a thermal management method that dissipates heat through direct physical contact between materials, relying on molecular energy transfer within and between solids to achieve temperature regulation.

85

Publications

4.5K

Citations

402

Authors

135

Institutions

Publications per year

2017–2026

23

Authors

402

  1. SK
    Seokho Kim

    Changwon National University, South Korea

    4 publications · 73 citations

    4

    h-index

  2. SH
    Seungyong Hahn

    Massachusetts Institute of Technology, United States

    3 publications · 51 citations

    3

    h-index

  3. KS
    Ki-Chul Seong

    Korea Electrotechnology Research Institute, South Korea

    3 publications · 62 citations

    3

    h-index

  4. KE
    Kenneth E. Goodson

    Stanford University, United States

    3 publications · 817 citations

    3

    h-index

  5. SH
    S. Hanai

    Toshiba (Japan), Japan

    3 publications · 265 citations

    3

    h-index

1–5 of 402

Venues

  1. IEEE Transactions on Applied Superconductivity

    29 publications · 637 citations

    16

    h-index

  2. Superconductor Science and Technology

    5 publications · 314 citations

    5

    h-index

  3. International Journal of Heat and Mass Transfer

    5 publications · 1.2K citations

    5

    h-index

  4. AIP conference proceedings

    3 publications · 46 citations

    3

    h-index

  5. 3

    h-index

1–5