Bottom-up Assembly Modeling

Bottom-Up Assembly Modeling is an assembly modeling approach in which individual components are designed and modeled separately before being incrementally integrated into a complete assembly, distinguished by its reliance on pre-existing, independently developed parts as the foundation for constructing higher-level assemblies.

15

Publications

971

Citations

74

Authors

28

Institutions

Publications per year

2017–2026

4

Authors

74

  1. ST
    S.T. Tan

    University of Hong Kong, Hong Kong SAR China

    1 publications · 34 citations

    1

    h-index

  2. TM
    Tatsuki Mitsui

    Komatsu (Japan), Japan

    1 publications · 23 citations

    1

    h-index

  3. AS
    Aditya Sanghi

    Autodesk (United States), United States

    1 publications · 60 citations

    1

    h-index

  4. ZX
    Zhijia Xu

    South China University of Technology, China

    1 publications · 16 citations

    1

    h-index

  5. SP
    Swati Pradhan-Bhatt

    University of Delaware, United States

    1 publications · 44 citations

    1

    h-index

1–5 of 74

Venues

  1. Computer-Aided Design

    3 publications · 165 citations

    3

    h-index

  2. 2

    h-index

  3. Journal of Chemical Education

    1 publications · 17 citations

    1

    h-index

  4. 1

    h-index

  5. ACS Nano

    1 publications · 53 citations

    1

    h-index

1–5