3
Publications
156
Citations
3
H-Index
2020
Active since
Jun Sheng is an author at Tsinghua University specializing in engineering, electrical engineering, and electronic packaging.
Top concepts
EngineeringElectrical EngineeringHeat TransferThermodynamicsThermal EngineeringElectronic PackagingSensorsBatteriesCorrosionSensor Design
Publications per year
2020–2022
3
3
An experimental study on the thermal characteristics of the Cell-To-Pack system
Huaibin Wang, Shuyu Wang, Xuning Feng et al. · Energy · 2021 · 55 citations
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