Tsung-Yi Yang

A novel flat polymer heat pipe with thermal via for cooling electronic devices

Kai‐Shing Yang, Tsung-Yi Yang, Cheng-Wei Tu et al. · Energy Conversion and Management · 2015 · 104 citations

Electronic Devices, Engineering, Heat Transfer Enhancement +9

Thermal spreading resistance characteristics of a high power light emitting diode module

Kai‐Shing Yang, Chi-Hung Chung, Cheng-Wei Tu et al. · Applied Thermal Engineering · 2014 · 61 citations

Electrical Engineering, Solid-state Lighting, Engineering +7

Optoelectronic systems based on InGaAs–complementary-metal-oxide-semiconductor smart-pixel arrays and free-space optical interconnects

Andrew Walker, Tsung-Yi Yang, J. Gourlay et al. · Applied Optics · 1998 · 18 citations

Engineering, Device Integration, Computer Architecture +21

Development of free-space digital optics in computing

J. Gourlay, Tsung-Yi Yang, J.A.B. Dines et al. · Computer · 1998 · 12 citations

Optical Materials, Engineering, Space Optic +16

Adaptive alignment packaging for 2-D arrays of free-space optical-interconnected optoelectronic systems

Tsung-Yi Yang, J. Gourlay, Andrew Walker · IEEE Transactions on Advanced Packaging · 2002 · 10 citations

Adaptive Alignment Packaging, Engineering, Optical Testing +19