A 1200-V, 60-A SiC MOSFET Multichip Phase-Leg Module for High-Temperature, High-Frequency Applications

Zheng Chen, Yiying Yao, Dushan Boroyevich, +3

IEEE Transactions on Power Electronics

Advanced PackagingSic MosfetElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors) +13

Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

Yiying Yao, Guo‐Quan Lu, Dushan Boroyevich, +1

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringGlass MaterialThermal PropertiesGlass-ceramicPolymer Technology +17

A Novel Hybrid Packaging Structure for High-Temperature SiC Power Modules

Ruxi Wang, Zheng Chen, Dushan Boroyevich, +3

IEEE Transactions on Industry Applications

Materials ScienceAdvanced PackagingElectrical EngineeringEngineeringAdvanced Packaging (Semiconductors) +13

Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging

Yiying Yao, Zheng Chen, Guo‐Quan Lu, +2

IEEE Transactions on Components Packaging and Manufacturing Technology

Flow TestEngineeringMechanical EngineeringStructural MaterialsAdvanced Packaging (Semiconductors) +20

Performance evaluation of SiC power MOSFETs for high-temperature applications

Zheng Chen, Yiying Yao, Milisav Danilovic, +1

Electrical EngineeringHigh-temperature PerformanceEngineeringHigh Temperature MaterialsHigh Voltage Engineering +12

An ultra-fast SiC phase-leg module in modified hybrid packaging structure

Zheng Chen, Yiying Yao, Dushan Boroyevich, +2

Sic Mosfet3D Ic ArchitectureElectrical EngineeringModified Hybrid StructureEngineering +10

Effect of Al2O3 fibers on the high-temperature stability of silicone elastomer

Yiying Yao, Guo‐Quan Lu, Dushan Boroyevich, +1

Polymer

Materials EngineeringMaterials ScienceEngineeringSilicone ElastomerMechanical Engineering +4

Development of a 1200 V, 120 A SiC MOSFET module for high-temperature and high-frequency applications

Zheng Chen, Yiying Yao, Wenli Zhang, +4

Advanced PackagingSic MosfetElectrical EngineeringEngineeringCommercial Sic Module +13

65nm CMOS high speed, general purpose and low power transistor technology for high volume foundry application

S.K.H. Fung, H.T. Huang, Sheng-Jen Cheng, +29

Low-power ElectronicsElectrical EngineeringEngineeringVlsi DesignCmos High Speed +13

A 1200 V, 60 A SiC MOSFET multi-chip phase-leg module for high-temperature, high-frequency applications

Zheng Chen, Yiying Yao, Dushan Boroyevich, +3