C. K. Gurumurthy

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

J. Jiao, C. K. Gurumurthy, Edward J. Kramer et al. · Journal of Electronic Packaging · 1998 · 40 citations

Engineering, Interfacial Fracture Toughness, Mechanical Engineering +16

Water-assisted sub-critical crack growth along an interface between polyimide passivation and epoxy underfill

C. K. Gurumurthy, Edward J. Kramer, Chung‐Yuen Hui · International Journal of Fracture · 2001 · 28 citations

Discoloration related failure mechanism and its root cause in electroless nickel immersion gold (ENIG) pad metallurgical surface finish

Chong Kam Meng, T.S. Selvamuniandy, C. K. Gurumurthy · 2004 · 21 citations

Engineering, Root Cause, Electrometallurgy +16

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris et al. · Journal of Electronic Packaging · 1998 · 18 citations

Engineering, Mechanical Engineering, Thermoplastic Composite +17

Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements

C. K. Gurumurthy, L. G. Norris, Chung‐Yuen Hui et al. · 2002 · 17 citations

Engineering, Mechanical Engineering, Underfill/passivation Interfacial Adhesion +20