Concepedia

Liguo Ding

LD

Statistics

Publications

2

Citations

37

H-Index

2

Active since

2023

Affiliations

Huazhong University of Science and Technology(Current)

Liguo Ding is an author at Huazhong University of Science and Technology specializing in microelectronics, viscoplastic flow, and shock waves.

Publications per year

2023–2023

2

Publications

2

Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method

Kai Yang, Longzao Zhou, Fengshun Wu et al. · Engineering Fracture Mechanics · 2023 · 19 citations

Engineering, Electrical Engineering, Materials Engineering +17

Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis

Guang Yang, Ee Lynn Lee, Kai Yang et al. · Journal of Electronic Materials · 2023 · 18 citations

Engineering, Materials Engineering, Materials Science +16

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