Concepedia

Chih-Cheng Hsiao

CH

Statistics

Publications

2

Citations

32

H-Index

2

Active since

2021

Affiliations

Industrial Technology Research Institute(Current)

Chih-Cheng Hsiao is an author at Industrial Technology Research Institute specializing in electronic packaging, engineering, and thin films.

Top concepts

EngineeringElectronic PackagingThin Films3D PrintingNanomaterials3D IntegrationMicrostructureNanotechnologyApplied PhysicsSurface Science

Publications per year

2021–2021

2

Publications

2

Miniaturized 3D Functional Interposer Using Bumpless Chip-on-Wafer (COW) Integration with Capacitors

Tatsuya FUNAKI, Yoshiaki Satake, Kyosuke Kobinata et al. · 2021 · 17 citations

3D Ic Architecture, Electrical Engineering, Wafer Scale Processing +13

Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration

Chih-Cheng Hsiao, Huan‐Chun Fu, Chia-Wen Chiang et al. · 2021 · 15 citations

Engineering, Mechanical Engineering, Feasibility Study +21

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