H. Hiyama

A Back Illuminated 10μm SPAD Pixel Array Comprising Full Trench Isolation and Cu-Cu Bonding with Over 14% PDE at 940nm

Ken Ito, Y. Otake, Y. Kitano et al. · 2020 · 30 citations

Engineering, Electrical Engineering, Materials Science +17

A Back Illuminated 6 µm SPAD Pixel Array with High PDE and Timing Jitter Performance

Shoichi Shimada, Y. Otake, S. Yoshida et al. · 2021 IEEE International Electron Devices Meeting (IEDM) · 2021 · 30 citations

Engineering, Electrical Engineering, Optoelectronics +16

A SPAD Depth Sensor Robust Against Ambient Light: The Importance of Pixel Scaling and Demonstration of a 2.5μm Pixel with 21.8% PDE at 940nm

Shoichi Shimada, Y. Otake, S. Yoshida et al. · 2022 International Electron Devices Meeting (IEDM) · 2022 · 19 citations

Engineering, Electrical Engineering, Optoelectronics +16

Effect of Surface Wettability on Frictional Conditions during Scrubbing Using Polyvinyl Acetal Brush

Yoshitaka Hara, Toshiyuki Sanada, Atsushi Fukunaga et al. · ECS Journal of Solid State Science and Technology · 2015 · 18 citations

Engineering, Materials Engineering, Materials Science +17

Brush Deformation Effects on Poly Vinyl Acetal Brush Scrubbing

Masayoshi Ito, Toshiyuki Sanada, Atsushi Fukunaga et al. · ECS Journal of Solid State Science and Technology · 2018 · 16 citations · Full text

Engineering, Materials Engineering, Materials Science +17