Nguyen Thi Minh Hai

X-ray Diffraction and STM Study of Reactive Surfaces under Electrochemical Control:  Cl and I on Cu(100)

Sascha Huemann, Nguyen Thi Minh Hai, Peter Broekmann et al. · The Journal of Physical Chemistry B · 2006 · 87 citations

Natural Sciences, Chemistry, Materials Science +17

Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives

Nguyen Thi Minh Hai, Jan Odermatt, Valentine Grimaudo et al. · The Journal of Physical Chemistry C · 2012 · 78 citations

Natural Sciences, Chemistry, Materials Science +15

Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

Nguyen Thi Minh Hai, Karl W. Krämer, Alexander Fluegel et al. · Electrochimica Acta · 2012 · 77 citations

Natural Sciences, Materials Engineering, Materials Science +16

On the role of halides and thiols in additive-assisted copper electroplating

Thi Mien Trung Huynh, Florian Weiss, Nguyen Thi Minh Hai et al. · Electrochimica Acta · 2012 · 76 citations

Natural Sciences, Materials Engineering, Materials Science +12

Synthesis of Chiral Self-Assembling Rhombs and Their Characterization in Solution, in the Gas Phase, and at the Liquid−Solid Interface

Kyung Seok Jeong, Sun Young Kim, Ueon‐Sang Shin et al. · Journal of the American Chemical Society · 2005 · 62 citations

Natural Sciences, Chemistry, Materials Science +17