Concepedia

Author

Tomonori Iizuka

Waseda University

Also Known As

Tomonori IIZUKA, Tomonori IiZuka, Tomonori Iizuka

51

Publications

1.1K

Citations

13

H-Index

38

Concepts

All Affiliations

Waseda UniversityKyushu Institute of TechnologyGraduate School USANitto (Japan)Kitakyushu Foundation for the Advancement of Industry, Science and Technology
TI

About

Tomonori Iizuka is an author at Waseda University specializing in materials science, engineering, and electrical engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

13

14

944

2

Electrical Engineering

9

9

195

3

Chemical Engineering

6

6

159

4

Applied Physics

3

3

479

5

Chemistry

1

1

63

Tomonori Iizuka

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15

Publications

955

Citations

13

H-Index

YearCitations

Role of Interface on the Thermal Conductivity of Highly Filled Dielectric Epoxy/AlN Composites

Xingyi Huang, Tomonori Iizuka, Pingkai Jiang,

The Journal of Physical Chemistry C

2012

448

Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength partI - sample preparations and thermal conductivity

Zengbin Wang, Tomonori Iizuka, Masahiro Kozako,

IEEE Transactions on Dielectrics and Electrical Insulation

2011

159

Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength part II-breakdown strength

Zengbin Wang, Tomonori Iizuka, Masahiro Kozako,

IEEE Transactions on Dielectrics and Electrical Insulation

2011

98

Electrical properties of epoxy/POSS composites with homogeneous nanostructure

Xingyi Huang, Yong Li, Fei Liu,

IEEE Transactions on Dielectrics and Electrical Insulation

2014

63

Effects of nano silica filler size on treeing breakdown lifetime of epoxy nanocomposites

Tomonori Iizuka, Toshikatsu Tanaka

2009

24

Voltage Endurance Characteristics of Epoxy/Silica Nanocomposites

Tomonori Iizuka, Katsumi Uchida, Toshikatsu Tanaka

IEEJ Transactions on Fundamentals and Materials

2009

23

High-Temperature-Resistant Interconnections Formed by Using Nickel Micro-plating and Ni Nano-particles for Power Devices

Noriyuki Kato, Suguru Hashimoto, Tomonori Iizuka,

Transactions of The Japan Institute of Electronics Packaging

2013

20

Tree initiation and growth in LDPE/MgO nanocomposites and roles of nano fillers

Toshikatsu Tanaka, Tomonori Iizuka, Yoitsu Sekiguchi,

2009

20

Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

Kohei Tatsumi, Masakazu Inagaki, Kazuhito Kamei,

2017

18

High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka, Zengbin Wang, Tomonori Iizuka,

2011

17

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