Concepedia

Wei Koh

WK

6

Publications

121

Citations

6

H-Index

2002

Active since

Affiliations

Powertech Technology (Taiwan)(Current)

Wei Koh is an author at Powertech Technology (Taiwan) specializing in engineering, electronic packaging, and materials engineering.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMaterials EngineeringApplied PhysicsMicroelectronicsMicrofabricationComputer EngineeringElectrical EngineeringMechanical Engineering

Publications per year

2002–2013

6

Publications

6

Copper pillar bump technology progress overview

Wei Koh, Barry Lin, Johnson Tai · 2011 · 42 citations

Engineering, Mechanical Engineering, Flip Chip Packages +20

A Digital Micro Magnetofluidic Platform For Lab-on-a-Chip Applications

Wei Koh, Khoi Seng Lok, Nam‐Trung Nguyen · Journal of Fluids Engineering · 2013 · 28 citations

Magnetic Properties, Chemiluminescence Assay, Engineering +11

System in package (SiP) technology applications

Wei Koh · 2006 · 15 citations

Non-volatile Memory, Engineering, Computer Architecture +19

Investigation of palladium coverage on bonded balls of palladium-coated copper wires

Wei Koh, Teck-Kheng Lee, Hun-Shen Ng et al. · 2011 · 13 citations

Materials Science, Materials Engineering, Electrical Engineering +15

Pitfalls and solutions of replacing gold wire with palladium coated copper wire in IC wire bonding

Lei-Jun Tang, Hong-Meng Ho, Wei Koh et al. · 2011 · 12 citations

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