Concepedia

Yung-Zhou Lin

YL

2

Publications

140

Citations

2

H-Index

2010

Active since

Affiliations

National Chung Hsing University(Current)

Yung-Zhou Lin is an author at National Chung Hsing University specializing in advanced packaging, microfabrication, and integrated circuits.

Top concepts

EngineeringApplied PhysicsMicroelectronicsMicrofabricationAdvanced PackagingIntegrated CircuitsElectronic PackagingElectrical EngineeringThree-dimensional Heterogeneous Integration

Publications per year

2010–2012

2

Publications

2

Cr(VI) Removal on Fungal Biomass of <i>Neurospora crassa</i>: the Importance of Dissolved Organic Carbons Derived from the Biomass to Cr(VI) Reduction

Liang‐Ching Hsu, Shan‐Li Wang, Yung-Zhou Lin et al. · Environmental Science & Technology · 2010 · 122 citations

High-aspect ratio through silicon via (TSV) technology

H.B. Chang, H.Y. Chen, Ping‐Chung Kuo et al. · 2012 · 18 citations

Advanced Packaging, High-aspect Ratio, Electrical Engineering +14

Rows per page

1–2 of 2