Statistics
Publications
1
Citations
41
H-Index
1
Active since
2018
Affiliations
C. Y. Hsieh is an author at Taiwan Semiconductor Manufacturing Company (Taiwan) specializing in electronic packaging, computer engineering, and advanced packaging.
Publications per year
2018–2018
1
1
High Performance, High Density RDL for Advanced Packaging
Chengpu Yu, Luo‐Ting Yen, C. Y. Hsieh et al. · 2018 · 41 citations
Advanced Packaging, Materials Science, Electrical Engineering +13
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