Heinz-Dietrich Brüns

Author

Also Known As

H Bruns, H-D. Brüns, H. Bruns, H. Brüns, H. D. Bruns, H.-D. Bruns, H.-D. Brüns, Heinz-Dietrich Bruns, Heinz-Dietrich Brüns, Hemz-D. Brüns

Publications

886

Citations

H-Index

Concepts

All Affiliations

Hamburg University of Technology Universität Hamburg IBM (United States)IBM Research - Thomas J. Watson Research Center Ajou University

About

Heinz-Dietrich Brüns is an author at Hamburg University of Technology specializing in engineering, computational electromagnetics, and electromagnetic compatibility.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	23	648
2	Computer Engineering	13	14	466
3	Applied Physics	4	4	248
4	Education	1	1	13
5	Natural Sciences	1	1	47

Heinz-Dietrich Brüns

Publications

676

Citations

H-Index

Page 1

	Year	Citations
Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz Renato Rímolo-Donadío, Xiaoxiong Gu, Young Kwark, IEEE Transactions on Microwave Theory and Techniques EngineeringPhysics-based ViaStructural OptimizationInterconnect (Integrated Circuits)Electromagnetic Compatibility	2009	174
Numerical Electromagnetic Field Analysis for EMC Problems Heinz-Dietrich Brüns, Christian Schuster, Hermann Singer IEEE Transactions on Electromagnetic Compatibility Numerical AnalysisElectromagnetic WaveElectrical EngineeringNumerical Method For Partial Differential EquationEngineering	2007	61
Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays S. Müller, Xiaomin Duan, Miroslav Kotzev, IEEE Transactions on Electromagnetic Compatibility Numerical AnalysisEngineeringSimulationComputer-aided DesignElectromagnetic Compatibility	2012	47
A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards Xiaomin Duan, Renato Rímolo-Donadío, Heinz-Dietrich Brüns, IEEE Transactions on Electromagnetic Compatibility EngineeringContour Integral MethodRadiated EmissionInterconnect (Integrated Circuits)Electromagnetic Compatibility	2010	45
Introducing a Mixed-Mode Matrix for Investigation of Wireless Communication Related to Orbital Angular Momentum Woocheon Park, Lei Wang, Heinz-Dietrich Brüns, IEEE Transactions on Antennas and Propagation RadarWireless CommunicationsWireless Communication RelatedEngineeringPhysics	2018	32
Extension of the Contour Integral Method to Anisotropic Modes on Circular Ports Xiaomin Duan, Renato Rímolo-Donadío, Heinz-Dietrich Brüns, IEEE Transactions on Components Packaging and Manufacturing Technology Numerical AnalysisFinite Element MethodElectrical EngineeringMethod Of Fundamental SolutionEngineering	2011	26
Complete Modeling of Large Via Constellations in Multilayer Printed Circuit Boards S. Müller, Fabian Happ, Xiaomin Duan, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringComputer ArchitectureComputer-aided DesignComputational MechanicsInterconnect (Integrated Circuits)	2013	25
Wireless Communication of Radio Waves Carrying Orbital Angular Momentum (OAM) Above an Infinite Ground Plane Lei Wang, Woocheon Park, Cheng Yang, IEEE Transactions on Electromagnetic Compatibility RadarWireless CommunicationsEngineeringRadio EngineeringPhysics	2020	21
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links S. Müller, Torsten Reuschel, Renato Rímolo-Donadío, IEEE Transactions on Electromagnetic Compatibility EngineeringVlsi DesignElectronic DesignComputer ArchitectureSignal Integrity	2015	18
Including Stripline Connections into Network Parameter Based Via Models for Fast Simulation of Interconnects Renato Rímolo-Donadío, Heinz-Dietrich Brüns, Christian Schuster EngineeringVia ModelsNetwork AnalysisSimulationComputer-aided Design	2009	18

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