Heinz-Dietrich Brüns

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Renato Rímolo-Donadío, Xiaoxiong Gu, Young Kwark et al. · IEEE Transactions on Microwave Theory and Techniques · 2009 · 174 citations

Engineering, Physics-based Via, Structural Optimization +22

Numerical Electromagnetic Field Analysis for EMC Problems

Heinz-Dietrich Brüns, Christian Schuster, Hermann Singer · IEEE Transactions on Electromagnetic Compatibility · 2007 · 61 citations

Numerical Analysis, Electromagnetic Wave, Electrical Engineering +12

Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays

S. Müller, Xiaomin Duan, Miroslav Kotzev et al. · IEEE Transactions on Electromagnetic Compatibility · 2012 · 47 citations

Numerical Analysis, Engineering, Simulation +25

A Combined Method for Fast Analysis of Signal Propagation, Ground Noise, and Radiated Emission of Multilayer Printed Circuit Boards

Xiaomin Duan, Renato Rímolo-Donadío, Heinz-Dietrich Brüns et al. · IEEE Transactions on Electromagnetic Compatibility · 2010 · 45 citations

Engineering, Contour Integral Method, Radiated Emission +25

Introducing a Mixed-Mode Matrix for Investigation of Wireless Communication Related to Orbital Angular Momentum

Woocheon Park, Lei Wang, Heinz-Dietrich Brüns et al. · IEEE Transactions on Antennas and Propagation · 2018 · 32 citations

Radar, Wireless Communications, Wireless Communication Related +15