Tobias Bernhard

Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications

Lérys Granado, Stefan Kempa, Laurence J. Gregoriades et al. · ACS Applied Electronic Materials · 2019 · 37 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Tanu Sharma, Ralf Brüning, Tang Cam Lai Nguyen et al. · Microelectronic Engineering · 2015 · 27 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

The effect of Ni on the kinetics of electroless Cu film deposition

Eric Logan, Tanu Sharma, Frank Brüning et al. · Thin Solid Films · 2017 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +12

Nickel dependence of hydrogen generation, hydrogen co-deposition and film stress in an electroless copper process

Tanu Sharma, Alexandre E. Landry, A. Leger et al. · Thin Solid Films · 2018 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +15

Stress of electroless copper deposits on insulating and metal substrates

Ralf Brüning, Allison Sibley, Tanu Sharma et al. · Thin Solid Films · 2014 · 15 citations

Natural Sciences, Materials Engineering, Materials Science +12