Frank Brüning

Kinetic regimes in the curing process of epoxy-phenol composites

Lérys Granado, Stefan Kempa, Laurence J. Gregoriades et al. · Thermochimica Acta · 2018 · 39 citations

Natural Sciences, Materials Engineering, Materials Science +16

Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications

Lérys Granado, Stefan Kempa, Laurence J. Gregoriades et al. · ACS Applied Electronic Materials · 2019 · 37 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Tanu Sharma, Ralf Brüning, Tang Cam Lai Nguyen et al. · Microelectronic Engineering · 2015 · 27 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

The effect of Ni on the kinetics of electroless Cu film deposition

Eric Logan, Tanu Sharma, Frank Brüning et al. · Thin Solid Films · 2017 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +12

Nickel dependence of hydrogen generation, hydrogen co-deposition and film stress in an electroless copper process

Tanu Sharma, Alexandre E. Landry, A. Leger et al. · Thin Solid Films · 2018 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +15