Concepedia

Henghua Jin

HJ

7

Publications

1.1K

Citations

7

H-Index

2010

Active since

Affiliations

University of Illinois Urbana-Champaign(Current)

CU Aerospace (United States)

Henghua Jin is an author at University of Illinois Urbana-Champaign specializing in engineering, self-healing materials, and materials science.

Top concepts

EngineeringSelf-healing MaterialsMaterial ScienceMechanical EngineeringMechanics Of MaterialsPolymer SciencePolymer ChemistryBiomedical EngineeringMechanicsWound Healing

Publications per year

2010–2015

7

Publications

7

Self-healing thermoset using encapsulated epoxy-amine healing chemistry

Henghua Jin, Chris L. Mangun, Dylan S. Stradley et al. · Polymer · 2011 · 346 citations

Chemical Engineering, Polymer Chemistry, Engineering +6

Robust, Double-Walled Microcapsules for Self-Healing Polymeric Materials

Mary M. Caruso, Ben Blaiszik, Henghua Jin et al. · ACS Applied Materials & Interfaces · 2010 · 238 citations

Materials Science, Polymer Chemistry, Engineering +12

Thermally Stable Autonomic Healing in Epoxy using a Dual‐Microcapsule System

Henghua Jin, Chris L. Mangun, Anthony Griffin et al. · Advanced Materials · 2013 · 214 citations

Materials Science, Polymer Chemistry, Engineering +12

Fracture and fatigue response of a self-healing epoxy adhesive

Henghua Jin, Gina M. Miller, Nancy R. Sottos et al. · Polymer · 2011 · 136 citations

Materials Science, Engineering, Self-healing Epoxy Adhesive +6

Fracture behavior of a self-healing, toughened epoxy adhesive

Henghua Jin, Gina M. Miller, Stephen J. Pety et al. · International Journal of Adhesion and Adhesives · 2013 · 111 citations

Materials Science, Engineering, Epoxy Adhesive +6

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