Concepedia

Yong-Kook Kim

YK

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Publications

1

Citations

34

H-Index

1

Active since

2005

Affiliations

Daejin University(Current)

Yong-Kook Kim is an author at Daejin University specializing in advanced packaging, materials engineering, and thermal engineering.

Top concepts

Publications per year

2005–2005

1

Publications

1

Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging

Gil-Soo Park, Yong-Kook Kim, Kyeong Kap Paek et al. · Electrochemical and Solid-State Letters · 2005 · 34 citations

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