Xiangcheng Luo - Concepedia

Author

Xiangcheng Luo

University at Buffalo, State University of New York

Also Known As

Xiangcheng Luo, Xiangcheng Luo,

Publications

853

Citations

H-Index

Concepts

All Affiliations

University at Buffalo, State University of New York

About

Xiangcheng Luo is an author at University at Buffalo, State University of New York specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	11	818
2	Applied Physics	5	5	173
3	Chemical Engineering	1	1	68
4	Chemistry	1	1	43
5	Civil Engineering	1	1	18

Xiangcheng Luo

Publications

831

Citations

H-Index

Page 1

	Year	Citations
Electromagnetic interference shielding using continuous carbon-fiber carbon-matrix and polymer-matrix composites Xiangcheng Luo, D.D.L. Chung Composites Part B Engineering Fiber ReinforcementElectrical EngineeringEngineeringComposite TechnologyContinuous-fibre Composite	1999	394
Carbon-fiber/polymer-matrix composites as capacitors Xiangcheng Luo, D.D.L. Chung Composites Science and Technology Materials ScienceEngineeringComposite TechnologyCarbon-fiber/polymer-matrix CompositesContinuous-fibre Composite	2001	85
Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance Yunsheng Xu, Xiangcheng Luo, D.D.L. Chung Journal of Electronic Packaging EngineeringMineral OilSodium SilicateThermal ConductivityChemical Engineering	1999	68
Electronic applications of flexible graphite Xiangcheng Luo, Randy Chugh, Brian C. Biller, Journal of Electronic Materials Materials ScienceGraphene NanomeshesEngineeringFlexible ElectronicsGraphene Fiber	2002	59
Vibration damping using flexible graphite Xiangcheng Luo, D.D.L. Chung Carbon EngineeringMechanicsMechanical EngineeringActive Vibration ControlVibration Isolation	2000	57
Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance Yunsheng Xu, Xiangcheng Luo, D.D.L. Chung Journal of Electronic Packaging EngineeringBoron Nitride ParticleChemistrySodium SilicateThermal Conductivity	2002	43
Flexible graphite under repeated compression studied by electrical resistance measurements Xiangcheng Luo, D.D.L. Chung Carbon Materials ScienceEngineeringMechanical PropertiesFlexible ElectronicsMechanical Behavior	2001	37
Graphite–graphite electrical contact under dynamic mechanical loading Xiangcheng Luo, D.D.L. Chung Carbon Materials ScienceEngineeringMechanical BehaviorMechanicsContact Mechanic	2001	32
Concrete-concrete pressure contacts under dynamic loading, studied by contact electrical resistance measurement Xiangcheng Luo, D.D.L. Chung Cement and Concrete Research EngineeringDynamic LoadingMechanicsContact MechanicCivil Engineering	2000	18
Effect of the thickness of a thermal interface material (solder) on heat transfer between copper surfaces Xiangcheng Luo, D.D.L. Chung The International journal of microcircuits and electronic packaging EngineeringMechanical EngineeringThermal ConductivityMolten StateHeat Transfer Process	2001	13

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