Concepedia

Hongfu Hou

HH

Statistics

Publications

3

Citations

61

H-Index

3

Active since

2016

Affiliations

Shanghai Jiao Tong University(Current)

Hongfu Hou is an author at Shanghai Jiao Tong University specializing in engineering, mechanical engineering, and thermal engineering.

Top concepts

Publications per year

2016–2018

3

Publications

3

Peripheral milling force induced error compensation using analytical force model and APDL deformation calculation

Zhengchun Du, Di Zhang, Hongfu Hou et al. · The International Journal of Advanced Manufacturing Technology · 2016 · 37 citations

, , +12

Thermal deformation isolation for satellite platforms via flexible connections

Zheng-Chun Du, Hongfu Hou, Zhiguo Wang et al. · International Journal of Precision Engineering and Manufacturing · 2017 · 13 citations

, , +8

A fast way to determine temperature sensor locations in thermal error compensation

Zhengchun Du, Xiaodong Yao, Hongfu Hou et al. · The International Journal of Advanced Manufacturing Technology · 2018 · 11 citations

, , +17

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