T.K. Tsai

ITO as a Diffusion Barrier Between Si and Cu

C. M. Liu, W. L. Liu, W.J. Chen et al. · Journal of The Electrochemical Society · 2005 · 69 citations

Natural Sciences, Materials Engineering, Materials Science +17

Temperature and pH dependence of the electroless Ni–P deposition on silicon

W.L. Liu, S.H. Hsieh, T.K. Tsai et al. · Thin Solid Films · 2006 · 57 citations

Engineering, Materials Engineering, Materials Science +13

Preparation of nanosized ZnO using α brass

W.J. Chen, W.L. Liu, S.H. Hsieh et al. · Applied Surface Science · 2007 · 40 citations

Natural Sciences, Materials Engineering, Materials Science +11

Spectral properties and thermal stability of CrN/CrON/Al2O3 spectrally selective coating

T.K. Tsai, Y.H. Li, Jau-Shiung Fang · Thin Solid Films · 2016 · 36 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of nickel on the initial growth behavior of electroless Ni–Co–P alloy on silicon substrate

W.L. Liu, W.J. Chen, T.K. Tsai et al. · Applied Surface Science · 2006 · 35 citations

Engineering, Materials Engineering, Materials Science +12