Shihua Yang

Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces

Zhihao Zhang, Mingyu Li, Zhi‐Quan Liu et al. · Acta Materialia · 2015 · 80 citations

Materials Science, Materials Engineering, Interface Chemistry +10

Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction

Zhihao Zhang, Huijun Cao, Mingyu Li et al. · Materials & Design · 2016 · 36 citations · Full text

Materials Science, Materials Engineering, Surface Characterization +13

Low temperature direct bonding of silica glass via wet chemical surface activation

Chengle Mai, Mingyu Li, Shihua Yang · RSC Advances · 2015 · 31 citations

Materials Science, Glass-ceramic, Engineering +9

Effects of post weld heat treatment (PWHT) on mechanical properties of C-Mn weld metal: Experimental observation and microstructure-based simulation

Chengze Zhang, Shihua Yang, Baoming Gong et al. · Materials Science and Engineering A · 2017 · 27 citations

Materials Science, Friction Welding, Engineering +11

Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications

Bo Hu, Fan Yang, Peng Ye et al. · Journal of Materials Science Materials in Electronics · 2019 · 21 citations

Materials Engineering, Ag Nanoparticle Paste, Materials Science +7