Adam J. Schwartz

Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials

Mukul Kumar, Adam J. Schwartz, Wayne E. King · Acta Materialia · 2002 · 286 citations

Materials Science, Materials Engineering, Engineering +11

Modifications to the microstructural topology in f.c.c. materials through thermomechanical processing

Mukul Kumar, Wayne E. King, Adam J. Schwartz · Acta Materialia · 2000 · 285 citations

Materials Science, Engineering, Material Processing +8

Effect of microstructural length scales on spall behavior of copper

Roger Minich, James U. Cazamias, Mukui Kumar et al. · Metallurgical and Materials Transactions A · 2004 · 175 citations

Materials Science, Engineering, Severe Plastic Deformation +9

Phonon Dispersions of fcc δ-Plutonium-Gallium by Inelastic X-ray Scattering

Joe Wong, M. Krisch, Daniel L. Farber et al. · Science · 2003 · 167 citations

X-ray Spectroscopy, Engineering, Electronic Structure +16

Toward Optimization of the Grain Boundary Character Distribution in OFE Copper

Wayne E. King, Adam J. Schwartz · Scripta Materialia · 1998 · 69 citations

Materials Science, Materials Engineering, Toward Optimization +11