Chin Chong Yap

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Active since

2012

Affiliations

Nanyang Technological University(Current)

Université de Limoges

Centre National de la Recherche Scientifique

Chin Chong Yap is an author at Nanyang Technological University specializing in electronic engineering, electronic packaging, and electromagnetic compatibility.

Top concepts

EngineeringApplied PhysicsNanoelectronicsMaterial ScienceMicroelectronicsMicrofabricationComputer EngineeringElectronic PackagingElectrical EngineeringElectronic Engineering

Publications per year

2012–2013

Publications

Carbon nanotube bumps for the flip chip packaging system

Chin Chong Yap, Christophe Brun, Dunlin Tan et al. · Nanoscale Research Letters · 2012 · 32 citations · Full text

Flip Chip Based on Carbon Nanotube–Carbon Nanotube Interconnected Bumps for High-Frequency Applications

Christophe Brun, Chin Chong Yap, Dunlin Tan et al. · IEEE Transactions on Nanotechnology · 2013 · 27 citations

Engineering, Interconnect (Integrated Circuits), Electromagnetic Compatibility +18

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