Jiangang Dai

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Active since

2021

Affiliations

State Key Laboratory of Electrical Insulation and Power Equipment(Current)

Xi'an Jiaotong University

Jiangang Dai is an author at State Key Laboratory of Electrical Insulation and Power Equipment specializing in semiconductor devices, microelectronics, and device reliability.

Publications per year

2021–2022

Publications

A Fully Coupled Model of Multi-Chip Press-Pack IGBT for Thermo-Mechanical Stress Distribution Prediction

Cao Zhan, Lingyu Zhu, Yaxin Zhang et al. · IEEE Transactions on Industry Applications · 2022 · 37 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Wear-Out Mechanism of Press-Pack IGBTs Under Accelerated Aging Test

Cao Zhan, Lingyu Zhu, Jiangang Dai et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2021 · 23 citations

Engineering, Electrical Engineering, Materials Science +17

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