Concepedia

Ling Hung Huong

LH

Statistics

Publications

1

Citations

26

H-Index

1

Active since

2017

Affiliations

Cypress Semiconductor Corporation (Japan)(Current)

Ling Hung Huong is an author at Cypress Semiconductor Corporation (Japan) specializing in thermal properties, fillers, and materials science.

Publications per year

2017–2017

1

Publications

1

Enhanced thermal and mechanical properties of epoxy composites filled with hybrid filler system of aluminium nitride and boron nitride

Anithambigai Permal, Mutharasu Devarajan, Ling Hung Huong et al. · Polymer Composites · 2017 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +17

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