Rick Brooks

Analytical Equivalent Circuit Modeling for BGA in High-Speed Package

Shuai Jin, Dazhao Liu, Bichen Chen et al. · IEEE Transactions on Electromagnetic Compatibility · 2017 · 30 citations

Engineering, Electrical Engineering, Circuit Theory +15

PCB via to trace return loss optimization for >25Gbps serial links

Ji Zhang, Jane Lim, Wei Yao et al. · 2014 · 29 citations

Engineering, Computer Engineering, Circuit Theory +13

Characterization of PCB dielectric properties using two striplines on the same board

Lei Hua, Bichen Chen, Shuai Jin et al. · 2014 · 22 citations

Natural Sciences, Electrical Engineering, Materials Science +17

ASIC package design optimization for 10 Gbps and above backplane serdes links

Jane Lim, K. Chow, Ji Zhang et al. · 2012 · 19 citations

Engineering, Computer Engineering, Electrical Engineering +17

Design of package BGA pin-out for >25Gb/s high speed SerDes considering PCB via crosstalk

Wei Yao, Jane Lim, Ji Zhang et al. · 2015 · 13 citations

Engineering, Computer Engineering, Electrical Engineering +17