Concepedia

Mingxing Du

MD

3

Publications

179

Citations

3

H-Index

2017

Active since

Affiliations

Tianjin University(Current)

Tianjin University of Technology

Mingxing Du is an author at Tianjin University specializing in electrical engineering, thermal engineering, and microelectronics.

ORCID

Top concepts

Publications per year

2017–2019

3

Publications

3

Online Calculation of the Increase in Thermal Resistance Caused by Solder Fatigue for IGBT Modules

Zhen Hu, Mingxing Du, Kexin Wei · IEEE Transactions on Device and Materials Reliability · 2017 · 78 citations

, , +20

An Adaptive Thermal Equivalent Circuit Model for Estimating the Junction Temperature of IGBTs

Zhen Hu, Mingxing Du, Kexin Wei et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2018 · 69 citations

, , +18

Condition Monitoring of IGBT Modules Based on Changes of Thermal Characteristics

Kexin Wei, Wenbai Wang, Zhen Hu et al. · IEEE Access · 2019 · 32 citations · Full text

, , +16

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