Concepedia

Yi Feng

YF

Statistics

Publications

13

Citations

526

H-Index

11

Active since

2009

Affiliations

KTH Royal Institute of Technology(Current)

Fudan University

Uppsala University

State Key Laboratory of ASIC and System

Yi Feng is an author at KTH Royal Institute of Technology specializing in engineering, electrical engineering, and electronic packaging.

Top concepts

EngineeringElectrical EngineeringMicroelectronicsElectronic PackagingMicrofabricationFlexible Electronics3D PrintingMaterial ScienceSensor DesignTechnology

Publications per year

2009–2025

13

Publications

13

Low-Cost Printed Chipless RFID Humidity Sensor Tag for Intelligent Packaging

Yi Feng, Li Xie, Qiang Chen et al. · IEEE Sensors Journal · 2014 · 253 citations

Advanced Packaging, Electrical Engineering, Energy Harvesting +13

Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates

Li Xie, Matti Mäntysalo, Ana López Cabezas et al. · Materials Letters · 2012 · 40 citations

Electrical Engineering, Engineering, Paper Substrates +9

Integration of f-MWCNT Sensor and Printed Circuits on Paper Substrate

Li Xie, Yi Feng, Matti Mäntysalo et al. · IEEE Sensors Journal · 2013 · 35 citations

Engineering, Smart Packages, Humidity Sensor +16

System integration of smart packages using printed electronics

Matti Mäntysalo, Li Xie, Fredrik Jönsson et al. · 2012 · 34 citations

Engineering, Device Integration, Smart Packages +17

Core–shell heterojunction engineering of Co<sub>3</sub>O<sub>4</sub>/NiFe LDH nanosheets as bifunctional electrocatalysts for efficient reduction of nitrite to ammonia

Yi Feng, Jin‐Tao Ren, Haoyu Wang et al. · Inorganic Chemistry Frontiers · 2023 · 30 citations · Full text

Materials Science, Efficient Reduction, Chemical Engineering +13

1–5 of 13