Seung-Zeon HAN

Formation of nano-sized grains in Cu and Cu−Fe−P alloys by accumulative roll bonding process

Cha‐Yong Lim, Seung-Zeon HAN, Seong-Hee Lee · Metals and Materials International · 2006 · 37 citations

Materials Science, Materials Engineering, Engineering +9

Fatigue Damage of Copper with Ultra-Fine Structure Due to ECAP

Masahiro Goto, Seung-Zeon HAN, Cha‐Yong Lim et al. · Journal of the Society of Materials Science Japan · 2004 · 21 citations · Full text

Engineering, Severe Plastic Deformation, Mechanical Engineering +16

The microstructural evolution during the equal channel angular pressing process and its relationship with the tensile behavior of oxygen-free copper

Seung-Zeon HAN, Cha‐Yong Lim, Chang-Joo Kim et al. · Metallurgical and Materials Transactions A · 2005 · 17 citations

Materials Science, Engineering, Severe Plastic Deformation +10

Effect of misch metal on elevated temperature tensile ductility of the Cu-Zn-Bi alloy

Younghwan Jang, Sangshik Kim, Seung-Zeon HAN · Metallurgical and Materials Transactions A · 2005 · 14 citations

Materials Science, Materials Engineering, Engineering +7

Role of trace elements on tensile behavior of accumulative roll-bonded pure copper

Younghwan Jang, Sangshik Kim, Seung-Zeon HAN et al. · Journal of Materials Science · 2005 · 11 citations

Materials Science, Engineering, Mechanical Engineering +9