Concepedia

C-T Pan

CP

2

Publications

218

Citations

2

H-Index

2001

Active since

Affiliations

National Chung Hsing University(Current)

National Tsing Hua University

Industrial Technology Research Institute

C-T Pan is an author at National Chung Hsing University specializing in electronic packaging, materials science, and engineering.

Top concepts

Publications per year

2001–2002

2

Publications

2

A low-temperature wafer bonding technique using patternable materials

C-T Pan, Hsiharng Yang, S-C Shen et al. · Journal of Micromechanics and Microengineering · 2002 · 139 citations

, , +20

Ultra-fine machining tool/molds by LIGA technology

Hsiharng Yang, C-T Pan, M.C. Chou · Journal of Micromechanics and Microengineering · 2001 · 79 citations

, , +15

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