Statistics
Publications
7
Citations
141
H-Index
7
Active since
2001
Lin Seng Ong is an author at Nanyang Technological University specializing in engineering, materials engineering, and materials science.
Publications per year
2001–2020
7
7
Finite element analysis for microwave cure of underfill in flip chip packaging
Lie Liu, Sung Yi, Lin Seng Ong et al. · Thin Solid Films · 2004 · 18 citations
Engineering, Electrical Engineering, Materials Engineering +16
Mei Ling Fam, Dimitrios Konovessis, Xuhong He et al. · Journal of Ocean Engineering and Science · 2020 · 13 citations · Full text
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