J. Q. Xu

Demystifying 3D ICs: The Pros and Cons of Going Vertical

W. Rhett Davis, John Wilson, Stephen Mick et al. · IEEE Design & Test of Computers · 2005 · 832 citations

Engineering, Computer Engineering, Electrical Engineering +17

3 Gb/s AC Coupled Chip-to-Chip Communication Using a Low Swing Pulse Receiver

Lei Luo, John Wilson, Stephen Mick et al. · IEEE Journal of Solid-State Circuits · 2005 · 83 citations

Engineering, Computer Engineering, Electrical Engineering +15

An architectural framework for providing reliability and security support

Nithin Nakka, Zbigniew Kalbarczyk, Ravishankar K. Iyer et al. · 2004 · 78 citations

Engineering, Computer Engineering, Computer Science +17

AC coupled interconnect for dense 3-D ICs

J. Q. Xu, Stephen Mick, John Wilson et al. · IEEE Transactions on Nuclear Science · 2004 · 33 citations

Engineering, Computer Engineering, Electrical Engineering +17

Research of Feature Extraction Method Based on Sparse Reconstruction and Multiscale Dispersion Entropy

Yidong Zhang, Shuiguang Tong, Feiyun Cong et al. · Applied Sciences · 2018 · 25 citations · Full text

Engineering, Mechanical Engineering, Feature Engineering +16