Youjung Kim

Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu

Haneul Han, Chaerin Lee, Youjung Kim et al. · Applied Surface Science · 2021 · 27 citations

Materials Science, Materials Engineering, High Density +11

Evolution of microstructures and mechanical properties of ultrahigh strength, pure electrodeposited Cu during self-annealing

Chaerin Lee, Youjung Kim, Rosa Kim et al. · Journal of Alloys and Compounds · 2020 · 18 citations

Materials Science, Materials Engineering, Engineering +9

Electrodeposition of stress-relaxation-induced (111)-oriented nanotwin copper film by direct current in additive-free electrolyte

Haneul Han, Jinmyeong Seo, Youjung Kim et al. · Electrochimica Acta · 2023 · 17 citations

Materials Science, Additive-free Electrolyte, Engineering +7

The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density

Haneul Han, Chaerin Lee, Youjung Kim et al. · Frontiers in Chemistry · 2022 · 16 citations · Full text

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)

Youjung Kim, Sanghyun Jin, Ki‐Moon Park et al. · Frontiers in Chemistry · 2020 · 15 citations · Full text

Engineering, Interconnect (Integrated Circuits), Semiconductor Device +18