Yun Bai

Effect of Particle Size Distribution on Powder Packing and Sintering in Binder Jetting Additive Manufacturing of Metals

Yun Bai, Grady Wagner, Christopher B. Williams · Journal of Manufacturing Science and Engineering · 2017 · 288 citations · Full text

Materials Science, Powder Processing, Engineering +12

An exploration of binder jetting of copper

Yun Bai, Christopher B. Williams · Rapid Prototyping Journal · 2015 · 251 citations

Powder Processing, Engineering, Copper Artifacts +18

Binder jetting additive manufacturing with a particle-free metal ink as a binder precursor

Yun Bai, Christopher B. Williams · Materials & Design · 2018 · 118 citations · Full text

Materials Science, Particle-free Metal Ink, Engineering +7

Effects of Hot Isostatic Pressing on Copper Parts Fabricated via Binder Jetting

Ashwath Yegyan Kumar, Yun Bai, Anders Eklund et al. · Procedia Manufacturing · 2017 · 114 citations · Full text

Engineering, Selective Inkjet Deposition, Mechanical Engineering +16

Impacts of process-induced porosity on material properties of copper made by binder jetting additive manufacturing

Ashwath Yegyan Kumar, Jue Wang, Yun Bai et al. · Materials & Design · 2019 · 107 citations · Full text

Engineering, Powder Compaction, Structural Materials +17